Thermal Analysis

ASENT’s Thermal Analysis tool leverages pioneering work in the physics of failure based analysis. This tool can help you proactively affect your board design by performing trade studies based on component placement, power dissipation, packaging, mounting technology, board composition, and cooling design. Five different cooling methods are available.

You can quickly identify or validate thermal-related problems, and identify and quantify potential solutions. The graphical analysis display lets you see the results, graphically showing vital information such as failure rate, stress, power consumption, and temperature (i.e., case, junction, layer, and substrate).

A powerful editing feature comes standard with this tool, which allows you to quickly change the board outline, composition, or component placement. When defining the board composition, you can create special regions of material or cutouts on board layers. Fully definable plated-thru holes, vias, and fin structures may also be added to assist with selected cooling methods.

Thermal results are used by the reliability prediction when calculating failure rates, thereby improving the accuracy of the prediction model.